AI Thermal and Mechanical Engineer

AI Thermal & Mechanical Engineer – Job Description

Mechanical & Thermal Systems Lead for Home AI Data Center Prototype

Location: Ho Chi Minh City, Vietnam

Type: Full-Time

Department: Hardware Engineering

Reports to: AI Hardware Systems Engineer / Founder

Industry: AI Hardware • High-Performance Consumer Electronics • Edge Computing

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About the Role

We are developing a next-generation Home AI Data Center — a compact, plug-and-play system that combines AI acceleration, gaming-level performance, and home server functionality in a single device.

We are seeking an experienced AI Thermal & Mechanical Engineer to design, prototype, and optimize the mechanical structure and cooling systems of the device. You will ensure the hardware can operate safely and efficiently under high-performance AI and gaming workloads while maintaining a sleek, consumer-ready design.

This role is critical to turning the hardware concept into a robust, functional, and thermally optimized prototype.

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Key Responsibilities

Thermal System Design

Design and implement advanced thermal management solutions including:

Cold plate and liquid cooling systems

Heat pipes, radiators, and airflow optimization

Thermal interface materials (TIMs) and heatsink integration

Model thermal loads using CFD or equivalent tools to ensure stable operation under AI/gaming workloads.

Collaborate with hardware engineers to ensure thermal designs support component longevity and system stability.

Mechanical Design

Design and prototype the enclosure/chassis for the compact AI Data Center.

Ensure precise integration of electronic components, cooling systems, and wiring harnesses.

Maintain structural integrity, vibration resistance, and durability.

Select materials and manufacturing methods suitable for prototype and eventual consumer production.

Prototype Development & Testing

Collaborate with the Assembly & Electronics Technician to build and test prototype units.

Conduct thermal and mechanical testing to validate designs.

Iterate designs based on testing results to optimize performance, noise, and reliability.

Collaboration

Work closely with the AI Hardware Systems Engineer on system layout and integration.

Provide mechanical and thermal input to the Software/UI Engineer to ensure smooth user interaction and airflow considerations.

Communicate progress, technical decisions, and recommendations directly to the founder.

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Ideal Candidate Profile

Technical Skills

Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, Mechatronics, or related field.

1 - 2 + years of experience in thermal design and mechanical engineering for electronics or high-performance computing devices.

Strong experience with CAD tools (SolidWorks, AutoCAD, CATIA, or similar).

Knowledge of thermal simulation and analysis (CFD, ANSYS, or equivalent).

Understanding of materials, tolerances, and manufacturability for metals, plastics, or hybrid enclosures.

Experience designing enclosures and cooling systems for compact, high-density electronics.

Ability to read and interpret mechanical drawings, schematics, and assembly guides.

Soft Skills

High attention to detail and precision in design work.

Strong problem-solving skills and ability to troubleshoot thermal or mechanical issues.

Good communication and teamwork skills.

Comfortable working in a fast-paced, prototype-driven environment.

Ability to iterate quickly and adapt designs based on testing feedback.

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Preferred Qualifications

Experience designing enclosures for high-performance PCs, servers, or AI systems.

Familiarity with vibration, acoustic, or shock mitigation techniques.

Experience with rapid prototyping tools (3D printing, CNC machining, laser cutting).

Experience in consumer electronics or startup hardware product development.

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What We Offer

Opportunity to lead the thermal and mechanical design of a first-of-its-kind AI hardware product.

Competitive salary for top engineering talent in Vietnam.

Direct collaboration with founders and senior engineers.

A chance to have ownership of your work and shape the product for global launch.

Requirements – AI Thermal & Mechanical Engineer

Minimum Education & Experience

Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, Mechatronics, or related field.

1 - 2 + years of experience in thermal management and mechanical design for electronics, servers, or high-performance computing devices.

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Technical Requirements

Proficient in CAD software: SolidWorks, AutoCAD, CATIA, or equivalent.

Experience designing enclosures, chassis, or mechanical assemblies for electronics.

Strong understanding of thermal management for high-density electronics:

Liquid cooling, cold plates, heat pipes, heatsinks

Airflow optimization and thermal load modeling

Experience performing thermal simulations (CFD, ANSYS, or similar).

Knowledge of materials, tolerances, and manufacturability for metals, plastics, and hybrid materials.

Ability to integrate mechanical and electronic components in compact designs.

Experience with prototyping, testing, and iterating mechanical/thermal systems.

Ability to read and interpret mechanical drawings, schematics, and assembly guides.

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Soft Skills & Professional Qualities

High attention to detail and precision in design.

Strong problem-solving skills, especially for thermal and structural issues.

Effective communication and teamwork skills.

Ability to work in a fast-paced, prototype-driven environment.

Comfortable iterating designs quickly based on test results.

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Preferred (Bonus) Qualifications

Experience designing enclosures for high-performance PCs, servers, or AI hardware.

Knowledge of vibration, shock, and acoustic mitigation techniques.

Familiarity with rapid prototyping methods: 3D printing, CNC machining, laser cutting.

Prior experience in consumer electronics or hardware startup product development.