Module Engineer (Contract Role)

How would you like to work in an organization that provide diverse and inclusive workplace where everyone respects and builds trust with each other? Are you a passionate learner who’s always looking for opportunities to improve and innovate? If this is what you are looking for, Intel is the place to be!

At Intel, we are always learning new things and pushing the boundaries…and that drives amazing experiences! We want you to dream big and help us take on some of the biggest technical challenges in the industry.

Intel Vietnam is the largest factory in Intel’s global Assembly and Test network and a critical site for our IDM2.0 strategy. The clean room facility is located at Saigon High Tech Park in Thu Duc city, Ho Chi Minh city. The site is proud of producing Intel’s latest technology chip products including 5G, IoT, Desktop, Mobile, etc.

We are looking welcome a Module Engineer into our team! A highly energetic individual with strong technical background to drive engineering solutions and enable new technology transfers.

Position 1: Module Engineer within Assembly Engineering Department

Responsibilities:

• Empowered to lead critical resolution of operational needs for the Assembly process and equipment.

• Optimize advanced process control systems to detect signals and automate defect containment

• Define maintenance and calibration procedures, partnering with technicians and manufacturing teams to sustain equipment OEE standards.

• Responsible to engage and lead new technology development, product transfers and process integration.

• Discover breakthrough innovations in process and equipment, with a focus on generating patentable solutions

• Spearhead Factory of the Future transformation through AI and Robotics deployment

• Actively engaged in our Virtual Factory (VF) network, driving cross site learnings and problem resolution

Position 2: Module Engineer within Test Engineering Department

Responsibilities:

• Responsible for designing and validating Test Tooling, PCB, Test Program for industry leading chips on latest advance packaging technology in partnership with Technology Development for both Internal and Foundry customers.

• Interface directly with customer in developing optimum Test Program interaction with Test Hardware (both Electrical and Thermomechanical) to achieve best-in-class product health indicators.

• Lead New Product Introduction process and technology definition from Engineering samples testing to production ready state.

• Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits.

• Conducts tests and measurements of their operations to ensure control over critical dimensions and defectivity of the process line.

• Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to meet safety, quality and cost indicator goals.

• Grows Insite manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to counterparts in manufacturing sites across the globe.

• Owns execution of maintenance and repair activities for equipment and relevant module of components.

• Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required.

• Owns process development line items aligned to high volume process nodes.

• Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites.

• Owns development and optimization of excursion prevention systems for the equipment and process.

• Owns detection of discrepant material or activities of the equipment and process to achieve high level of quality.

• During factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes).

Position 1: Module Engineer within Assembly Engineering Department

Qualifications:

• Bachelors or Masters degree in following Engineering fields – Electrical and Electronics, Mechanical, Mechatronics, AI/Robotics, Chemical and/or other related majors.

• Fresh graduates are invited to apply for the Module Engineer entry-level position.

• Strong English articulation and written communication skills.

• Self-motivated, team-oriented individual with a strong data driven mindset. Willingness to hand on and positive learning attitude.

• Willing to work on 12-hour shift (based on business need with additional allowances).

Preferred:

• Highly knowledgeable in statistical and problem-solving tools like 8D, FMEA, Lean Six Sigma methodology, JMP statistical analysis is a must for experience candidate

• Expertise in Machine Learning and Robotics with proficiency in Python, OpenVino, Tensorflow, C++, ROS (Robot Operating System), MATLAB, Gazebo, V-REP, Webots and familiarity with embedded systems and real-time programming.

• Preferred Experience in Advance Packaging, Package Technology Development and semiconductor packaging with specific focus on Equipment design, DFA/DFM design rules, PFMEA assessments and developing control plans to enhance process capability.

• Experience working with direct material, thermal mechanical and modelling.

Position 2: Module Engineer within Test Engineering Department

Qualifications:

• Bachelor's degree in Electronics, Electrical, Automation Control, Computer Engineering, Mechanical Engineering, Mechatronics or related field.

• Proficient in using and interpreting Solidworks (SW) and other Computer-aided Design App for use in mechanical and or PCB design / drawing will be an advantage.

• And/or Years of experience in maintaining Industry Standard Tester and Handler Equipment will be an advantage.

• Years of experience as Class Test Program developer and achieved high level of debug proficiency in quickly isolating problems between TP, product or Hardware will be an advantage.

• Demonstrate discipline, attentiveness to detail and self-independence.

• Capable to timely manage multiple assignments and meet the deliverable timeline.

• Fluent communication in English and be able to work in team.

• Fresh graduates are welcome to apply.