NPI Engineer

Involve in tooling design, new material exploration, new generation die technology characterization and new technology of assembly for semiconductor industry

Troubleshooting the issue during development stage with analytical and technical skill

Exploring new technology in the market and competitor movement.

Develop process flow for new package development in semiconductor.

Proficient in written and conversational English

FOE:

Strong knowledge FOL processes: Wafer dicing, Die bond, Wire bond, Re-flow.

Having knowledge of Printing, Splintering, Clip attach is preferred.

Semiconductor processes and Material knowledge on lead frame, wire, and solder, paste OR a very quick learner and walk extra miles to pick up new knowledge

Back End:

Strong knowledge of Plating/surface treatment and material

Having knowledge of Transfer Molding, Trim and Form is preferred.

Semiconductor processes and Material knowledge on Plating, Mold Compound, wire, and solder OR a very quick learner and walk extra miles to pick up new knowledge

Equipment and tooling design and hands on experience.

Proactive and initiative to look for solution

Able to work independently

Understand DOE and process characterization.

Min level 3 Auto Cad application.

Added advantages with SPC software applications such as JMP and statical software.

Understand solid state of semiconductor, especially on integrated circuit design and application.