R&D Engineer (Up to Manager)

Key Responsibilities

1. Follow semiconductor package processes and procedures on the production line

2. Optimize PKG processes & materials (Mold, Laser, SBA, Saw, AVI/FVI)

3. Conduct DOE (Design of Experiments), perform data analysis

4. Troubleshoot issues and propose innovative solutions to improve yield

5. Prepare buy-off reports (e.g., MBO, LBO) for customer approval

1.Educational background:

• Bachelor’s degree or higher in Science or Engineering

2. Experiences:

• More than 3 years of experience as a Process Engineer or in a related field

• Experience in statistical analysis tools such as JMP or Minitab

• Experience in semiconductor packaging processes

• Skilled in report preparation and customer communication

3. Skills:

• Strong English communication skills (speaking, listening, writing)

• Familiar with semiconductor PKG equipment and processes

• Skilled in PKG machine recipe control.

• Effective team collaboration, communication, and presentation skills.

• Knowledge of basic production procedures and failure analysis.

• Proficient in MS Office (Excel, Word, PowerPoint).

• Capable of troubleshooting process issues.

• Experience in failure analysis, RMA handling, and 8D reporting.

4. Other:

• Willing to train and work abroad (Korea) for about 3 months